CASE STUDY: HIGHLY MACHINED ASSEMBLIES FOR SEMICONDUCTOR TOOLS

PROBLEM: Customer needed assemblies built from custom machined parts for semiconductor fabrication equipment. They were unable to locate any facility in the U.S. who could take on such a complicated project, especially since they had incomplete drawings for all parts.

SOLUTION: Our engineers were able to complete all drawings, manage production of the parts and construct the final assembly exactly to the OEM's specifications.

RESULTS: Customer continues to source this and other assemblies from FES. Not only can FES deliver these as complete, ready-to-work units, but we can do it while saving them over 35% in costs and 40% in lead time.

    The following services were utilized:

  • Reverse engineering
  • Sourcing of standard parts
  • High precision machining and polishing
  • Tolerance testing
  • Final assembly and quality control
  • Specialized packaging

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